ALD87 AOI SMT Welding Defect Visual Inspection Instrument

3D Height Mapping Technology

• Multi-angle laser triangulation captures micron-level topography (≤5μm resolution)

• Detects subtle defects: tombstoning (component lift), coplanarity issues, and solder volume anomalies 

• Identifies micro-cracks and voiding in BGA/CSP joints through depth-aware analysis

Comprehensive Defect Library

• Pre-loaded detection algorithms for 50+ defect types including:

• Bridging (solder shorts) and insufficient solder

• Solder balls (tin splatter) and cold joints 

• Component misalignment (≤15μm positional accuracy) 

• Adaptive learning engine reduces false calls by analyzing thermal stress patterns from soldering profiles 

Smart Process Optimization

• Real-time SPC dashboards track critical parameters:

• Solder paste volume consistency (prevents tombstoning/voids) 

• Component placement drift (detects <0.1° rotational errors)

• Automated feedback loop with stencil printers/pick-and-place machines

Advanced Package Compatibility

• Supports emerging 3D packaging technologies:

• 2.5D/3D IC stacks with TSV interconnects 

• Hybrid bonding assemblies (≤1μm bump pitch verification) 

• Validated for ultra-thin die stacks (50μm thickness) in advanced memory modules

Technical Specifications

• Throughput: 25 panels/hour (standard 450×350mm boards)

• Lighting: 12-channel programmable multi-spectral illumination

• Optics: 25MP 4K coaxial imaging + 8-line laser scanner

• Software: ALD VisionAI 4.0 with deep learning defect classification

Industry-Leading Value

• Defect Escape Rate: <0.02% @ CPK ≥1.67

• ROI Accelerator: 40% faster setup vs. conventional 3D AOI

• Future-Ready: Field-upgradable to support chip-on-wafer and wafer-level packaging inspection