Emerson Showcases Advanced Packaging Solutions at PACK EXPO 2026

Transforming High-Speed Packaging with Emerson's Innovations \\[10/08/26, 01:28 PM | Automation & IIoT, Engineering | EMERSON] \\As the demand for efficient and reliable packaging solutions continues to grow in Southeast Asia, global technology leader Emerson is set to showcase its cutting-edge pressure, motion, and control solutions at PACK EXPO 2026. From October 18-21, visitors to Booth N-5449 in Chicago will have the opportunity to explore how these innovations can benefit their operations. \\### Precision and Reliability in Packaging Lines \\Emerson's AVENTICS and Afag brands offer a range of solutions designed to stabilize processes across high-speed packaging lines. For factories in Thailand, Vietnam, Indonesia, and Malaysia, this means improved reliability and quality in PET and glass molding, as well as greater flexibility and hygiene in thermoform, fill, and seal (TFFS) applications. The AVENTICS proportional valves, dome regulators, and blowing blocks are engineered to enhance the performance of PET and glass molding, reducing process inconsistencies and minimizing bottle bursting. \\### Customized Solutions for Enhanced Throughput \\Customized filling valve units, pusher units, and smart sensors from Emerson are tailored to improve throughput and food safety on filling lines. These solutions are particularly beneficial for food and beverage manufacturers in ASEAN, where maintaining high standards of hygiene and efficiency is crucial. By incorporating these technologies, factories can achieve higher production rates while ensuring product integrity and safety. \\### Interactive Demonstrations and Expert Insights \\Visitors to the Emerson booth will have the chance to engage with experts and see live demonstrations of the company's comprehensive packaging portfolio. One highlight is the hybrid motion demonstration, which showcases the integration of servo drives, motors, electric actuators, and pneumatics. This combination allows machine builders to leverage the speed and precision of electronic actuation with the flexibility and compliance of pneumatic actuators, providing a versatile solution for various packaging needs. \\Another key feature is the interactive product wall, which includes a website configurator for the AVENTICS Series XV valve system. With millions of possible configurations and high flow rates, these valves offer enhanced design flexibility and scalability, making them ideal for handling systems and other packaging applications. \\### Key Takeaways for Factory Buyers \\For factory buyers in ASEAN, the Emerson booth at PACK EXPO 2026 offers valuable insights into how advanced pressure, motion, and control solutions can drive operational excellence. By adopting these technologies, factories can achieve faster, smarter, and more reliable packaging lines, ultimately leading to increased productivity and reduced costs. Visit Emerson at Booth N-5449 to learn more about these innovative solutions and how they can be tailored to meet your specific needs.