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Front view of XONJE XJ-E500A UV laser cutting machine for high-precision FPC and PCB depaneling applications
Front view of XONJE XJ-E500A UV laser cutting machine for high-precision FPC and PCB depaneling applications Front view of XONJE XJ-E500A UV laser cutting machine for high-precision FPC and PCB depaneling applications

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XONJE XJ-E500A FPC Laser Splitting Machine

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Laser splitting machine, used for cutting FPC, PCBA, covering film window opening, cutting complex graphics, high accuracy, stable performance, and better cost-effectiveness.
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Product Features:

1. Equipped with a high peak power 15W 355nm ultraviolet laser, the power is stable with small attenuation, and there is no need to worry about the impact of power attenuation on cutting quality and speed;


2. Integrated CTI high-precision scanning galvanometer and Yokogawa high-precision linear motor platform, with high operating accuracy;


3. Professional cutting software can directly import DXF graphics made by CAD, and accurately cut according to the input graphics, leading to precise and efficient cutting;


4. After optimizing the design of the optical path, the speed and effect can be optimized at the same power level, and efficient dust prevention treatment can be carried out to effectively reduce equipment downtime, cleaning and maintenance cycles;


5. The equipment adopts a marble shockproof platform, with a stable and solid overall structure, and an integrated closed structure, providing guarantee for high-speed, high-precision, and high yield production; The software is compatible with various types of functions, easy to operate, easy to learn and understand, and can learn basic operations in a short time;


6. Suitable for SMT production lines, mainly used for cutting FPC, PCB, fingerprint module, camera module, TYPE-C interface, and various precision PCB/FPC boards with corresponding stress requirements in the 3C industry production.


Product Parameter:


ParameterSpecification
Cutting area350 × 350 mm
Galvanometer scanning range42 × 42 mm
Positioning accuracy±0.02 mm
Cutting accuracy±0.02 mm
Cutting thickness0–1.0 mm
Platform movement speed0–1000 mm/s
Laser15W UV solid-state laser
Motion controlPC + motion control card + vision + linear motor platform
Scanning galvanometerImported from the United States
Cutting platformMarble platform
Water chillerXONJE patent
Working voltageAC 380V, 4 kW
Weight1200 kg
Overall dimensions1100 mm (L) × 1200 mm (W) × 1650 mm (H)


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