Product Features:
1. Stress free cutting, with minimal stress of 200 on the split plate μ E left and right
2. MARK point precise positioning, short programming time, simple and fast operation
3. Visual high-definition industrial camera, automatic camera
4. High speed dual spindle, milling and saw blades
5. Dual station efficient cutting
6. Windows/Linux system, Chinese and English interface
7. Suitable for PCB cutting with a thickness of 0.3-6.0mm, V-groove, point connection, and surface connection
8. The most advanced real-time cutting and dust removal process
9. Completely solve the cross V-slot cutting of components
10. After splitting, the cutting surface is flat and bright
11. Solve the problem of changing machines and lines for the mixed board (stamp holes, V-cut slots)
Product Parameter:
| Parameter | Specification |
| Splitting speed | 0–100 mm/s |
| Milling cutter speed | 0–60,000 RPM |
| Saw blade speed | 0–40,000 RPM |
| Repetitive accuracy | ±0.02 mm |
| Cutting accuracy | ±0.05 mm |
| Plate thickness range | 0–6 mm |
| Working voltage | AC 380V, 5 kW |
| Working air pressure | 0.5–0.7 MPa |
| Vacuum suction method | Upper suction |
| Weight | 760 kg |
| External dimensions | 1080 mm (L) × 1100 mm (W) × 2200 mm (H) |
