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Product Advantage:
1. Suitable for processing materials with large thermal radiation reaction.
2. Stable performance, small size, low power consumption.
3. The heat affected area is small, there will be no thermal effect, and the material will not be deformed or burnt; Fast marking speed and high efficiency;
4. Integrated modular overall structure design, humanized operation process.
5. Applicable: metal hardware, wood plastic, glass products, precision electronics, hyperfine engraving all materials.
Parameters:
Laser power: 3W/5W/10W
Laser wavelength: 355nm
Cooling method: water cooling
Laser working medium: ultraviolet
Marking speed: <8000mm/s
Marking accuracy: 0.01mm
Working voltage: AC220V/50Hz
Product Advantage:
1. Suitable for processing materials with large thermal radiation reaction.
2. Stable performance, small size, low power consumption.
3. The heat affected area is small, there will be no thermal effect, and the material will not be deformed or burnt; Fast marking speed and high efficiency;
4. Integrated modular overall structure design, humanized operation process.
5. Applicable: metal hardware, wood plastic, glass products, precision electronics, hyperfine engraving all materials.
Parameters:
Laser power: 3W/5W/10W
Laser wavelength: 355nm
Cooling method: water cooling
Laser working medium: ultraviolet
Marking speed: <8000mm/s
Marking accuracy: 0.01mm
Working voltage: AC220V/50Hz