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Front view of XONJE XJ-600A inline saw blade PCB cutting machine featuring Mark point correction and low-stress V-groove separation
Front view of XONJE XJ-600A inline saw blade PCB cutting machine featuring Mark point correction and low-stress V-groove separation Front view of XONJE XJ-600A inline saw blade PCB cutting machine featuring Mark point correction and low-stress V-groove separation
Automatic PCB saw cutting system with real-time path display, tool depth management, and upper vacuum dust removal design Automatic PCB saw cutting system with real-time path display, tool depth management, and upper vacuum dust removal design
V-groove PCB separator with servo-controlled cutting, flat finish, and 200MIC low-stress precision operation V-groove PCB separator with servo-controlled cutting, flat finish, and 200MIC low-stress precision operation

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XONJE XJ-600A Online Saw Blade Splitting Machine

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Machine Introduction: Suitable for V-slot PCB slitting, especially for PCB slitting of parts across V-slots; Widely used in industries such as automobiles, power supplies, computers, home appliances, mobile phones, connectors, LED, etc
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Product Features:

1. Realize unmanned production, suitable for cutting PCBA boards connected to V-CUT;


2. Suitable for V rough PCB splitting of fiberboard, aluminum substrate, and copper substrate;


3. Mark point automatic correction cutting solves the problem of incoming material deviation for different batches of products;


4. Equipped with cutting path and image display functions, the actual cutting path corresponds to PCB images in real-time, with strong visualization;


5. Equipped with tool depth management function, suitable for deep cutting with components on the reverse side of the cutting point, ensuring good PCBA cutting without damaging components;


6. Patented design for real-time cutting and dust removal process;


7. Can completely solve the problem of cross V-slot cutting of components;


8. The stress on the dividing plate is extremely low, around 200MIC, and the cutting surface is flat and bright;


Product Parameter:

ParameterSpecification
Working modeOnline
Number of workstationsSingle workstation
Partition area300 × 300 mm
Control methodPC control computer + servo
Splitting speed0–100 mm/s
Component heightMax height: front side 10 mm, reverse side 10 mm
Repetitive accuracy±0.02 mm
Splitting accuracy±0.05 mm
Working voltageAC 380V, 5 kW
Working air pressure0.5–0.7 MPa
Spindle speed0–40,000 RPM
Plate thickness range0–6 mm
Vacuum suction methodUpper suction
Weight800 kg
External dimensions1200 mm (L) × 1100 mm (W) × 1650 mm (H)


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